Overview

AMD adaptive SoCs and FPGAs support many different memory technologies internal or external to the device. With programmable logic often being used as accelerators in processing platforms, many AMD devices support all cache coherent interfaces, including the CCIX open standard and CXL®.

  • Internal Memory: UltraScale+™ devices add 288 Kb UltraRAM to established internal memory types
  • High Bandwidth Memory: 3D IC memory for higher bandwidth relative to DDR4/DDR5 solutions
  • Parallel External Memory: Flexible interfaces to LPDDR5X, DDR5, LPDDR4, DDR4, RLDRAM3, and QDRIV
  Versal™ Adaptive SoC UltraScale+ UltraScale™ 7 Series Spartan™ 6
Block RAM 239 Mb 94 Mb 36 Kb 50 Mb 4 Mb
UltraRAM 717 Mb 360 Mb – – –
High Bandwidth Memory  (HBM) 32 GB 16 GB – – –
External Max Data Rate 8533 Mb/s 2667 Mb/s 2400 Mb/s 1866 Mb/s 800 Mb/s

 

Internal Memory (HBM, RAM)

Integrated HBM and RAM

AMD products contain different types of internal memory for different design needs. 

  • Distributed RAM uses LUTs for coefficient storage, state machines, and small buffers
  • Block RAM is useful for fast, flexible data storage and buffering
  • UltraRAM blocks each provide 288 Kb and can be cascaded for large on-chip storage capacity
  • HBM (High Bandwidth Memory) is ideal for high capacity with higher bandwidth relative to discrete memory solutions
  Versal Adaptive SoC UltraScale+ UltraScale 7 Series Spartan 6
Distributed RAM Size 64-bit 64-bit 64-bit 64-bit 64-bit
Distributed RAM Capacity Range 0.6 – 258 Mb 1.2 Mb – 48.3 Mb 4.1 Mb – 28.7 Mb 70 Kb – 21 Mb 75 Kb – 1.3 Mb
Block RAM Size 36 Kb 36 Kb 36 Kb 36 Kb 18 Kb
Block RAM Capacity Range 0.8 Mb – 239 Mb 5.3 Mb – 94.5 Mb 12.7 – 132.9 Mb 180 Kb – 66.1 Mb 216 Kb – 4.7 Mb
UltraRAM Size 288 Kb 288 Kb – – –
UltraRAM Capacity Range 6.8 Mb – 717 Mb 90 Mb – 360 Mb – – –
HBM Stack Size 8 GB – 16 GB 4 GB – 8 GB – – –
HBM Capacity Range 8GB – 32 GB 4 GB – 16 GB – – –

External Memory Interfaces

AMD offers a comprehensive set of physical layer memory interfaces and memory controllers for varied bandwidth, efficiency, and low latency requirements. Based on a rigorous characterization process to determine specifications, supported interfaces include LPDDR5X, LPDDR5, and LPDDR4 components, DDR5, DDR4, and DDR3 multi-rank DIMMs, including UDIMM, SODIMM, and RDIMM. Refer to the following tools to plan your memory interface design and implementation:

AMD memory controllers are included in the Vivado™ IP Catalog at no extra charge.

Refer to the device data sheet for a full list of supported memory standards and maximum data rates.

Tools

AMD provides best-in-class tools to estimate memory performance, interface capacity, and power consumption to maximize performance-per-watt and accelerate design and implementation. Below are a variety of memory- and power-related tools to get started today.

Memory Selection Guide

Relative Merit DDR4 DIMM HMC RLDRAM 3 QDR-IV LPDDR4 Virtex UltraScale+ HBM Device Versal HBM Adaptive SoC
Bandwidth 21 GB/s 160 GB/s 10.8 GB/s 16.8 GB/s 9.6 GB/s 460 GB/s 820 GB/s
Density 32 GB 2 GB 280 MB
(0.280 GB)		 18 MB
(0.018 GB)		 4 GB 16 GB 32 GB
Price / GB $ $$$ $$ $$ $$ $$ $$
PCB Requirement High Medium High High High
 None None
Power (pJ/bit) ~27 ~30 ~40 ~27 ~19 ~7 ~6
Latency Med High Low Low Med Med Med

Resources

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