Fidus Systems, Inc.

  • Partner Tier: Premier
  • Program Member Since: 2002
  • Certified Engineers: 20
    • Ottawa, ON, CA (Headquarters)
    • Fremont, CA, US (Design Office)
    • Fremont, CA, US (Sales Office)
    • Kitchener, ON, CA (Design Office)

Partner Information

Distinguished as AMD’s first North American-based Adaptive Computing Premier Design Services Partner, Fidus Systems is uniquely trained, qualified, and supported to provide electronic product development and consulting services for AMD customers across a wide range of industries. Leading the way with Versal adoption, Fidus specializes in high-speed, high complexity designs involving Hardware, FPGA (including HLS, Dynamic Function eXchange, AMP, etc) Signal Integrity, Embedded Software, Verification, PCB Layout, Wireless, DSP, and Mechanical design.

As a design partner, Fidus offers companies greater flexibility and capability in their product development with access to the expertise, process, and tools to successfully move your products to market. Fidus has delivered on more than 4000 products and projects for 400+ customers across North America. Fidus can assist virtually any client across North America with our network of design centers. Click “Request Information” to contact your Fidus Business Manager today!

Products/Services

  • Boards and Kits
  • Design Services

Markets Supported

  • Audio Video and Broadcast
  • Automotive
  • Consumer Electronics
  • Data Center
  • Aerospace and Defense
  • Industrial
  • Medical
  • Test and Measurement
  • Wired Communications
  • Wireless Communications

Design Competencies

  • Digital Signal Processing
  • Embedded Application Development
  • Embedded Porting - BSP Extension
  • Embedded Processors
  • FPGA Design and Integration
  • FPGA Design Optimization
  • FPGA Timing Closure
  • Industrial and Mechanical Design
  • Industry Certification and Compliance Testing
  • PCB Design and Layout
  • RF and Analog Design
  • Image Sensor Fusion
  • Signal Integrity Design and Analysis
  • System Architecture

Maximum Service Scope

  • Board Level Design

Engagement Model

  • Time and Materials
  • SOW-Based Fixed Bid Projects
  • Captive Engineering Resources at Partner and Customer Location