Informs customers that Advanced Micro Devices, Inc. is adding a wafer sort test site in Taiwan for all our Zynq™ UltraScale+™ Commercial (XC), Automotive (XA), and Defense (XQ) products. There are no changes to reliability, form, fit, or function.

Communicates that Advanced Micro Devices, Inc. is discontinuing Alveo™ V70 Accelerator cards and selected standard and Specification Control Documents (SCDs).

Communicates that Advanced Micro Devices, Inc. is discontinuing selected standard and Specification Control Documents (SCDs) for SmartSSD Computational Storage Drive (CSD).

Communicates that Advanced Micro Devices, Inc. is discontinuing two Telco™ Accelerator cards due to Chinese market restrictions.

Product discontination notice.

Communicates that Advanced Micro Devices, Inc. is discontinuing selected standard and specification control documents (SCDs) for Alveo™ accelerator cards.

Informs customers that Advanced Micro Devices (AMD), Inc will be transitioning all Xilinx logos and branding to the AMD logo and branding for all Xilinx™ 7 series, Zynq™ 7000, and newer physical products including but not limited to silicon, boards, accessories as well as associated packaging material. There are no changes to form, fit, function, or reliability of the products.

Communicates that Advanced Micro Devices, Inc. is discontinuing selected standard and specification control documents (SCDs) Alveo™ accelerator cards for operational efficiency and better serve customers with consolidated standard products.

The purpose of this notification is to announce Advanced Micro Devices, Inc. will begin the transition to lead-free C4 bump and lead-free substrates for the Commercial “XC” and Defense-grade “XQ” devices in Virtex™ 7, Kintex™ UltraScale™, Virtex UltraScale, and Virtex UltraScale+™ families.

Product discontination notice.

Discontinuance notice of XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/Industrial "XC" and Automotive "XA" Product Families

Announce the addition of substrate surface finish type for all Commercial "XC", Automotive "XA", and Defense-grade "XQ". "XC", Automotive "XA", and Defense-grade "XQ" products in FCBGA packages.

Product discontinuation notice for Virtex Ultrascale+ high-bandwidth memory products.

Product discontination notice.

Announces that AMD is discontinuing selected 8000 Series Ethernet Adapters.

Product discontination notice.

Retracted the announcement of the addition of die attach epoxy for All Automotive "XA" and Defense-grade "XQ" grades products in CABGA and PBGA wire bond packages.

Announces that AMD-Xilinx is converting the bump to lead-free for Virtex-4/-5/-6 and Series 7 FPGAs Defense (XQ) and Space (XQR) flip-chip products.

Announces that AMD-Xilinx is discontinuing the Alveo A-U25-P06G-PQ-G Ethernet PCIe SmartNIC product.

The purpose of this notification is to communicate that Xilinx® is discontinuing selective XQ18V00 product family and Platform Flash PROMs products due to supplier line discontinuance.

The purpose of this notification is to communicate that Xilinx® is discontinuing selective Defense (XQ) and Space (XQR) FPGA products. This product discontinuance notice applies to all speed and temperature-grade variations.

The purpose of this notification is to communicate that Xilinx® is discontinuing the Kintex® UltraScale™ FPGA KCU1250 Characterization Board, Zynq® UltraScale+ RFSoC ZCU216 Production Evaluation Kit, Zynq UltraScale+ RFSoC Gen 3 8T8R Limited Distribution Evaluation Kit, Zynq UltraScale+ RFSoC Gen 3 16T16R Limited Distribution Evaluation Kit, and Vivado® Design and System Editions.

The purpose of this notification is to communicate that Xilinx® is discontinuing the XtremeScale X2562 product.

The purpose of this notification is to communicate that Xilinx® is discontinuing Spartan®-II PQ(G)208 package pin products. This product discontinuation notice (PDN) applies to all speed and temperature-grade variations in this package pin for Spartan-II family only.

The purpose of this notification is to communicate that Xilinx® is discontinuing selective CoolRunner™ XPLA3 CPLD device package pin. This product discontinuation notice (PDN) applies to all speed and temperature-grade variations in the stated package pins.

The purpose of this notification is to communicate that Xilinx® is discontinuing XQV(R)300 and XQV(R)600 products. This product discontinuation notice (PDN) applies to all speed and temperature-grade variations in the stated package pins.

The purpose of this notification is to announce a change to the Xilinx® Alveo™ U200, U250 and U280 Product PCBA revision for operations process efficiency. There is no change to the form, fit, function, or reliability.

The purpose of this notification is to communicate that Xilinx® is discontinuing the Zynq® UltraScale+™ RFSoC ZCU208 Engineering Sample Evaluation Kit, Zynq UltraScale+ RFSoC ZCU216 Engineering Sample Evaluation Kit, Versal™ VMK180 Engineering Sample Evaluation Kit and Versal VCK190 Engineering Sample Evaluation Kit.

The purpose of this notification is to communicate that Xilinx® is discontinuing the X2552 product.

FAQ: Implications of XCN18024