IC-FEP-VPX3d - 3U VPX FPGA board with FMC+ Site

The IC-FEP-VPX3d takes advantage of Kintex® UltraScale™ family capabilities and features by offering scalability, performance, connectivity and reliability. The Kintex ® UltraScale™ FPGA built on a high performance, low power 20nm process technology is available in multiple models providing different features while keeping the same package and footprint. Hence, the IC-FEP-VPX3d is available with a selection of 3 FPGAs (KU060, KU085 or KU115), and speed grades 1, 2 & 3.The FPGA 2133MB/s bus interfaces with the 2 DDR4 banks remove bottleneck in DSP and packet processing, maximizing the board transfer performance. The Fabric links of the VPX backplane are connected to the FPGA GTHs (FPGA dependent) transceivers, allowing data rates up to 16.3 Gbps, and up to 32 differential pairs. The Embedded Hard IP Resources can be used to implement PCI Express Gen2/Gen3 (FPGA dependent) links, as well as the 10 Gigabit Ethernet ports (XAUI, 10GBASE-KR). The FMC+ site is compliant with the FPGA Mezzanine Card standard (VITA 57.4). The IC-FEP-VPX3d is available from standard, air-cooled to conduction-cooled grades (85°C). Furthermore, Kintex ® UltraScale™ interfaces with a local flash for local storage of up to 2 bitstreams. It supports secured bitstreams and partial reconfiguration. Due to the modularity of the FPGA, the IC-FEP-VPX3d is compliant with several Module Profiles of the OpenVPX standard.