Overview

Cost-Optimized

The balance between feature set
and affordability

Power Efficient

The balance between performance and power

Small Form Factor

The balance between physical size and logic resources

Choose a Scale Above the Rest

Innovative Silicon. Superior Software. Lower Total Solution Cost. 

The numbers don’t lie. Check out the white papers, design lounge, and more to see how AMD does it better.

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COP covers

Comprehensive AMD Cost-Optimized Portfolio

The AMD Cost-Optimized Portfolio includes various FPGAs such as AMD Spartan™ and Artix™ families, select adaptive SoCs like the AMD Zynq™ families, and spans multiple process nodes from 45 nm to 16 nm.

AMD Spartan UltraScale+ Diagram
Tried. Trusted. Long Lasting.

With typical lifespans extending well past 15 years, you can depend on AMD devices for the life of your design—extending AMD 7 Series FPGAs and adaptive SoCs through 2040 and AMD UltraScale+™ FPGAs and adaptive SoCs through 2045.

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AMD UltraScale+™ Devices

AMD Spartan UltraScale+

Spartan™ UltraScale+™ FPGAs

I/O, Power, Security-Optimized

AMD Spartan UltraScale+ FPGAs are optimized for cost-sensitive applications requiring high I/O count, low- power, and state-of-the-art security features. With densities ranging from 11 kLC to 218 kLC and up to 572 I/Os, Spartan UltraScale+ FPGAs excel in a wide range of use cases, from I/O expansion and board management to sensor processing and control.

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AMD Artix UltraScale+

Artix™ UltraScale+ FPGAs

Transceiver and Signal Processing Optimized

AMD Artix UltraScale+ FPGAs offer high data throughput and DSP compute, providing up to 192 Gb of aggregate bandwidth. Key applications include embedded and video processing, wireless communications, advanced driver assistance systems (ADAS), and industrial IoT.

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AMD Zynq UltraScale+

Zynq™ UltraScale+ MPSoCs

Embedded Processing Optimized

AMD Zynq UltraScale+ MPSoCs integrates the Arm® processor subsystem and UltraScale programmable logic architecture in a single device. Key applications include high-speed networking, high-performance computing, 5G wireless, automotive, avionics, and industrial control systems.

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AMD 7 Series Devices

AMD Spartan

Spartan 7 FPGAs

Low Density and Smallest Packaging

AMD Spartan 7 FPGAs offers an outstanding choice for low density and small form factor. With devices as small as 6K logic cells, engineers can do a lot with a little. Spartan 7 FPGAs pack 100 I/Os in a miniscule 0.5 mm pitch, 8x8 mm footprint as well as 0.8 mm and 1.0 mm pitch options. The devices are ideal for any-to-any connectivity, protocol conversion, bridging, sensor fusion, and embedded vision applications

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AMD Artix

Artix 7 FPGAs

Low Density with Transceivers and DSP

AMD Artix 7 FPGAs provides up to sixteen 6.6 Gb/s transceivers, enabling efficient and robust data communication and DDR3 support for faster data bandwidth. Simultaneously, the DSP capabilities facilitate signal processing with high throughput. The family offers a great value for modest signal processing applications, such as software-defined radio and low-end wireless backhaul.

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AMD Zynq 7000 SoC

Zynq 7000 SoCs

Low Density with Hardened Processors

AMD Zynq™ 7000 SoCs family offers the smallest possible devices with hardened processors, embedded memory controllers, and 7 series programmable logic. The family offers devices as small as a single-core Arm® Cortex®-A9 processor running up to 766 MHz with 23K logic cells or a dual-core Arm Cortex-A9 processor running up to 866 MHz with 28K logic cells. Zynq 7000 SoCs are ideal for system management and flexible computing applications.

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AMD 6 Series Devices

Design Confidently

AMD takes our commitment to long lifecycles very seriously. We are pleased to announce that support is formally being extended for Spartan™ 6 devices until at least 2030.

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Unlocking Innovation with Cost-Optimized FPGAs and Adaptive SoCs eBook

Unlocking Innovation with Cost-Optimized FPGAs and Adaptive SoCs eBook

Innovations like machine vision and AI at the edge require new architectures that are flexible, energy efficient, and low cost. This eBook explores the differences between FPGAs, adaptive SoCs, ASICs, and other standard processors to help you decide which approach is best for your application. Learn how you can elevate your next design to meet the increasing complexity of today’s innovations without compromising on performance or efficiency.

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Product Table

Solving diverse industry-specific problems with performance and flexibility

AMD FPGA Cost-Optimized Devices

  Spartan 6 FPGA Spartan 7 FPGA Artix 7 FPGA Artix UltraScale+ FPGA Spartan UltraScale+ FPGA
Logic Cells / System Logic Cells (K) 147 102 215 308 218
Total RAM (Mb)1 6.2 5.4 16.0 15.2 26.79
DSP Slices 180 160 740 1200 384
Transceiver Count @ Speed (Gb/s) 8 @ 3.2 - 16 @ 6.6 12 @ 16.375 8 @ 16.375
DDR Interface @ Speed (Mb/s) DDR3 @ 800
(Hard MC)		 DDR3 @ 800
(Soft MC)		 DDR3 @ 1,066
(Soft MC)		 DDR4 @ 2,400
(Soft MC)		 LPDDR4x/5 @ 4,266
(Hard MC) and DDR4 @ 2,400
(Soft MC)
PCI Express® Interface Gen1x1 - Gen2x4 Gen4x4 Gen4x8
I/O Pins 576 400 500 304 572
Processing System
Application Processor Unit MicroBlaze™ MicroBlaze V MicroBlaze V MicroBlaze V MicroBlaze V
Real-Time Processor Unit MicroBlaze MicroBlaze V MicroBlaze V MicroBlaze V MicroBlaze V
Graphics Processor Unit 3rd Party IP 3rd Party IP 3rd Party IP 3rd Party IP 3rd Party IP
Memory Interfaces DDR3 @ 800
(Hard MC)		 DDR3 @ 800
(Soft MC)		 DDR3 @ 1,066
(Soft MC)		 DDR4 @ 2,400
(Soft MC)		 LPDDR4x/5 @ 4,266
(Hard MC) and DDR4 @ 2,400
(Soft MC)

AMD FPGA Cost-Optimized Devices

  Zynq 7000 SoC
Z-7007S, Z-7012S, Z-7014S, Z-7010, Z-7015, Z-70202		 Zynq UltraScale+ MPSoC
ZU1, ZU2, ZU3, ZU3T2
Logic Cells / System Logic Cells (K) 85 157
Total RAM (Mb)* 5.9 21.2
DSP Slices 220 576
Transceiver Count @ Speed (Gb/s) 4 @ 6.25 4 @ 6.0 and 8 @ 12.5
DDR Interface @ Speed (Mb/s) DDR3 @ 1,066
(Hard MC)		 DDR4 @ 2,666
(Hard MC)
PCI Express® Interface Gen2x4 Gen3x8
I/O Pins 328 466
Processing System
Application Processor Unit Single / Dual-core Arm® Cortex®-A9 Dual / Quad-core Arm Cortex-A53
Real-Time Processor Unit MicroBlaze and MicroBlaze V Dual-core Arm Cortex-R5F
Graphics Processor Unit 3rd Party IP Mali™-400MP2
Memory Interfaces DDR3, DDR3L, DDR2, LPDDR2, 2x Quad-SPI, NAND, NOR x16: DDR4 w/o ECC; x32/x64: DDR4, LPDDR4, DDR3, DDR3L, LPDDR3 w/ ECC, 2x Quad-SPI, NAND

1. Total RAM = Maximum Distributed RAM + Total Block RAM + UltraRAM
2. Larger devices up to Z-7100 and ZU19 also available

Not sure which device is right for your design? Check out the full Product Selection Guide

Product Selection Guide

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