Spartan-6 FPGA Data Sheet

This overview outlines the features and product selection of the Defense-grade Spartan-6Q Family.

EN170: Errata for the Spartan-6Q defense-grade FPGA production devices.

Package drawing for 484-ball Laminate Chip Scale BGA (CS484/CSG484)

CS484 Material Declaration Data Sheet

Spartan-6 FPGA Configuration User Guide

Spartan-6 FPGA SelectIO Resources User Guide

Spartan-6 FPGA Clocking Resources User Guide

Spartan-6 Block RAM User Guide

Spartan-6 FPGA Configurable Logic Block User Guide

Spartan-6 FPGA Packaging and Pinouts Product Specification

Spartan-6 FPGA GTP Transceivers User Guide

Spartan-6 FPGA DSP48A1 Slice User Guide

Spartan-6 FPGA PCB Design Guide

Spartan-6 FPGA Power Management User Guide

This white paper describes the various threats to design security and the solutions offered by modern FPGAs.

This application note describes how to implement the single-chip cryptography (SCC) technology developed by Xilinx using the isolation design flow (IDF).

This application note provides techniques to use the advanced features of the Xilinx FPGA slice to create high-speed, efficient, datapath multiplexers.

To inform customers of a change to the Humidity Indicator Card (HIC). There is no change to the form, fit, or function.

To communicate that Xilinx is making a minor marking template and tray change to some plastic ball grid array FG(G) and BG(G) packages.

This notification is to advise customers of a change to the supported values for the BUFIO2 and BUFIO2_2CLK primitives DIVIDE attribute for all Spartan -6 FPGAs.

To announce the transitioning of passivation material change for wafers of Spartan -6 FPGA Defense-grade “XQ” products.

To announce the transitioning of epoxy molding compound for Spartan®-6 FPGA Defense-grade “XQ” wire bond package products. There is no change to the fit, form, function or MSL rating of the packages.

Frequently Asked Questions: Implications of XCN15007

Frequently Asked Questions: Implications of XCN15007