Zynq UltraScale+ RFSoC DFE ZCU670 Evaluation Kit
by: AMD
The Zynq™ UltraScale+™ RFSoC DFE ZCU670 Evaluation Kit is the optimal platform for adaptive radio development and out-of-box evaluation in rapid prototyping of 5G New Radio (5G NR), radar, and a breadth of RF applications. This product is available to qualified customers. Please contact your local sales representative or visit the contact sales form.
Overview
This product is in early access with availability to qualified customers.
Contact your local sales representative to learn how to join the early access program.
Product Description
The Zynq RFSoC DFE ZCU670 Evaluation Kit is a superb RF 5G wireless test platform for both out-of-box evaluation and rapid prototyping of RF applications for 5G NR and radar.
The kit features the Zynq UltraScale+ RFSoC DFE device featuring integrated RF data converters and a breadth of power-efficient 5G NR cores for a complete hardened radio subsystem. As an adaptive SoC, the device features programmable logic for hardware differentiation and adaptability to future market requirements.
Key Features & Benefits
Target Applications
- Wireless: 5G massive-MIMO, multi-mode macrocell, mmWave radio as IF transceiver, small cell nodes
- Aerospace & Defense
- Test & Measurement
Industry’s only adaptable radio platform, now with hardened 5G NR cores
- A monolithic, analog, and digital device based on 16nm TSMC process
- Integrated 8T8R RF data converters for 7.125GHz direct-RF bandwidth and 400MHz instantaneous bandwidth (iBW)
- Power-optimized 5G NR cores including DUC, DDC, DPD, CFR, and Low-PHY processing IP
- UltraScale+ programmable logic for hardware differentiation and adaptability to future market requirements and use cases
- Arm® processing subsystem for RF calibration, digital pre-distortion (DPD) processing, and more
Connectivity Options for Rapid Application Development
- DDR4 Component – 4GB, 64-bit, 2666MT/s, connectivity to programmable logic (PL)
- DDR4 SODIMM – 4GB 64-bit, 2400MT/s, connectivity to processing subsystem (PS)
- Quad zSFP/zSFP+ cage assembly
Mezzanine Cards and Reference Designs for Expandability
- FMC+ connector enabling I/O expansion, with connectivity to 34 differential I/O signals and 12x 32Gb/s transceiver I/O
- XM650 RFMC 2.0 card for N79 band loopback, enabling out-of-the-box loopback and example reference layout for baluns
- XM755 RFMC 2.0 breakout card for in-depth lab-based measurements, including multi-tile synchronization (MTS)
Featured AMD Devices
Featuring the Zynq RFSoC DFE XCZU67DR-2FSVE1156I
| 14-bit, 2.9GSPS RF-ADC | 8 |
|---|---|
| 14-bit, 5.9GSPS RF-ADC | 2 |
| 14-bit, 10GSPS RF-DAC | 8 |
| DFE | Integrated |
| System Logic Cells (K) | 489 |
| Memory (Mb) | 67.8 |
| DSP Slices | 1,872 |
| 28.21Gb/s Transceivers | 8* |
| Maximum I/O Pins | 154 |
* A subset of the available I/Os and transceivers on the silicon device are mapped on the kit. Please reference the Board User Guide for actual mapping.
NOTE: The table shows max specifications for the device independent of the board. Please refer to the Board User Guide for specifications of the device on the board.
Product Information
Board Features
Featuring the Zynq™ RFSoC DFE XCZU67DR-2FSVE1156I
| Board Specifications | Value |
|---|---|
| Height | 12.225 inch (31.05 cm) |
| Width | 10.675 inch (27.11 cm) |
| Thickness (+/-5%) | 0.119 inch (0.302 cm) |
| Operating Environmental Temperature | 0◦C to +45◦C |
| Storage Environmental Temperature | -25◦C to +60◦C |
| RF Data Converter | |
| # of 14-bit RF-ADCs @ 2.95 GSPS | 8 |
| # of 14-bit RF-ADCs @ 5.9 GSPS | 2 |
| # of 14-bit RF-DACs @ 10* GSPS | 8 |
| Memory | |
| PS DDR4 | 4GB 64-bit SODIMM |
| PL DDR4 | 4GB 64-bit Component |
| MicroSD Card | 16GB |
| QSPI | 4GB |
| Communications & Networking | |
| USB (UART/JTAG) | 1 |
| RJ-45 | 1 |
| SFP28 | 4 |
| USB 3.0 | 1 |
| Expansion Connectors | |
| FMC+ | 1 |
| RFMC 2.0 | 2 |
| CLK104 Connector (card not included) | 1 |
| Add-on Cards | |
| XM650 | 1 |
| XM755 | 1 |
| Control & I/O | |
| DIP Switches | 2 |
| LEDs | 4 |
| Push Buttons | 6 |
| I2C | 2 |
| PMBus | 1 |
| JTAG PC4 Header | 1 |
| Boot Options | |
| SD Boot | Yes |
| QSPI Boot | Yes |
| JTAG Boot | Yes |
| Power | |
| 12V Wall Adapter | Yes |
| ATX Power Compatible | Yes |
* -2I speed grade silicon
What's Inside the Box
Resources
Design Tools
- Vivado™ ML Enterprise Edition: The EDA tool suite to create projects for the ZCU670 board. Node-locked and device-locked to the Zynq™ UltraScale+™ XCZU67DR RFSoC DFE with one year of updates.
- Vitis™ Unified Software Platform: The full suite of tools for developing embedded software, debugging RFSoC DFE devices, and running targeted reference designs and example designs.
PetaLinux Tools, Board Support Packages, and Pre-Built Images
Additional Tools
- RF Analyzer: A board-independent debugging tool for all Zynq UltraScale+ RFSoC devices
- Power Advantage Tool: A tool to measure power data and control power-related features in a design
Getting Started with the ZCU670 Evaluation Kit
Visit the wiki page to jump-start prototyping and cutting-edge RF application development with the ZCU670 Evaluation Kit.
The Quick Start Guide includes:
- How to setup the ZCU670 board and information on kit components
- Using the System Controller UI to configure the board
- Working with the RF Analyzer to check the RF performance of the silicon and board
Get Started
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